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Multi-chip package (NAND MCP) products are designed on the same substrate based on different storage technology processes. The superior chip stacking technology not only optimizes the design space of circuit boards, but also different storage technology products, including SLC NAND Flash and mobile DRAM. The power consumption DDR1, DDR2 or DDR4 is designed on a substrate. For applications to achieve faster startup time, longer battery life and higher reliability, the combination of mainstream NAND MCP products is 1Gb + 512Mb; 2Gb + 1Gb; 4Gb + 2Gb; 4Gb + 4Gb (NAND and low power DRAM).